Laser processing of materials encompasses several sectors ranging from automotive and aerospace to medical and microelectronics. However, an in-depth understanding of the light-solid interaction has been elusive due to a very broad range of length (microscopic to macroscopic) and time (femtosecond to microsecond) scales involved. Therefore, characterization of machining/modification dynamics requires optimization of both experiment and theory. This will provide unprecedented opportunities towards smart machining that enables remote, in-situ monitoring/sensing with active capabilities to tune optical properties or to reconfigure optical circuits. It also facilitates to develop new methods to overcome the fundamental difficulties imposed by diffraction limit of light. With growing demand for high-speed data transmission, optical circuits will have to soon replace copper due to its bandwidth and speed limitations. Laser processing of materials will play a crucial role in fabricating embedded, re-configurable waveguide circuits on an electro-optical printed circuit board.